For temperature-sensitive materials. Its low melting temperature makes the Low-Melt adhesive particularly suitable for heat-sensitive materials, such as PU foam and polystyrene. With an application temperature of only 130¡C, it protects the base surface it is applied to. The material is firm after a maximum of 40 seconds, with a strong bond being provided after approx. 80 - 100 seconds. (Times and recommended adhesive are rough guides only).
- Temperature: 130 ¡C
- Strong bond after: max. 50 sec.
- Firm after: approx. 90 sec.
- Ideal for heat-sensitive materials such as PU foam and polystyrene.
